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| Advance Product Information May 16, 2000 Ka Band Low Noise Amplifier TGA1307-EPU Key Features and Performance * * * * * * Chip Dimensions 2.54 mm x 1.15 mm 0.25um pHEMT Technology 23-29 GHz Frequency Range 3.1 dB Nominal Noise Figure 28GHz 17 dB Nominal Gain OTOI > 22dBm 5V, 50 mA Self-Bias Primary Applications * * Point-to-Point Radio Point-to-Multipoint Communications 10 9 8 7 6 Vd = 5V, Id1 45mA Typical NF @ 25C 5 4 3 R/C 35_35 2 1 0 18 R/C 50_50 R/C 59_59 R/C 70_70 R/C 75_75 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 Frequency (GHz) 25 EG1307 Fixtured Small Signal Data, Wafer 991880601 Vd = 5V, Id1 45mA 20 15 Typical Gain @ 25C 10 R/C 9_21 R/C 40_35 5 R/C 47_31 R/C 44_15 R/C 50_30 0 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 Frequency (GHz) Note: Devices designated as EPU are typically early in their characterization process prior to finalizing all electrical and process specifications. Specifications subject to change without notice TriQuint Semiconductor Texas : Phone (972)994-8465 Fax (972)994 8504 Web: www.triquint.com 1 Advance Product Information May 16, 2000 TGA1307 0 EG1307 Fixtured Small Signal Data, Wafer 991880603 Vd = 5V, Id1 45mA 0 -10 EG1307 Fixtured Small Signal Data, Wafer 991880603 Vd = 5V, Id1 45mA -2 -20 R/C 50_32 R/C 59_30 R/C 70_30 R/C 35_31 R/C 75_15 -4 -30 -40 -50 R/C 50_32 -6 -8 R/C 59_30 R/C 70_30 R/C 35_31 R/C 75_15 -60 -70 -80 -10 -12 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 Frequency (GHz) 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 Frequency (GHz) 25 EG1307 Fixtured Small Signal Data, Wafer 991880603 Vd = 5V, Id1 45mA 0 EG1307 Fixtured Small Signal Data, Wafer 991880603 Vd = 5V, Id1 45mA 20 -2 -4 15 -6 10 R/C 50_32 R/C 59_30 R/C 70_30 R/C 35_31 -8 R/C 50_32 R/C 59_30 R/C 70_30 R/C 35_31 R/C 75_15 5 R/C 75_15 -10 0 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 Frequency (GHz) -12 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 Frequency (GHz) Typical Small Signal S-parameters at 25C. Note: Devices designated as EPU are typically early in their characterization process prior to finalizing all electrical and process specifications. Specifications are subject to change without notice. TriQuint Semiconductor Texas : Phone (972)994-8465 Fax (972)994 8504 Web: www.triquint.com Advance Product Information May 16, 2000 TGA1307 0 -2 -4 -6 -8 -10 -12 -14 -16 -18 -20 18 19 20 21 Temp: -60 Temp: -25 Temp: 0 Temp: 25 Temp: 50 Temp: 75 EG1307 S11 Lot 9918806 wafer 2 5V R/C 60 24 25 EG1307 S21 Lot 9918806 wafer 2 5V R/C 60 24 20 15 Temp: -60 10 Temp: -25 Temp: 0 Temp: 25 Temp: 50 5 Temp: 75 0 22 23 24 25 26 27 28 29 30 31 32 33 34 35 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 Frequency (GHz) Frequency (GHz) 0 -10 -20 -30 -40 -50 -60 -70 18 19 20 21 Temp: -60 Temp: -25 Temp: 0 Temp: 25 Temp: 50 Temp: 75 EG1307 S12 Lot 9918806 wafer 2 5V R/C 60 24 0 -2 -4 -6 Temp: -60 EG1307 S22 Lot 9918806 wafer 2 5V R/C 60 24 -8 -10 -12 22 23 24 25 26 27 28 29 30 31 32 33 34 35 18 19 Temp: -25 Temp: 0 Temp: 25 Temp: 50 Temp: 75 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 Frequency (GHz) Frequency (GHz) Small Signal S-parameters over temperature. Note: Devices designated as EPU are typically early in their characterization process prior to finalizing all electrical and process specifications. Specifications are subject to change without notice. TriQuint Semiconductor Texas : Phone (972)994-8465 Fax (972)994 8504 Web: www.triquint.com Advance Product Information May 16, 2000 TGA1307 10 9 8 7 6 5 4 3 R/C 35_35 Vd = 5V, Id1 45mA 2 1 0 18 R/C 50_50 R/C 59_59 R/C 70_70 R/C 75_75 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 Frequency (GHz) Typical Noise Figure - 5 devices Note: Devices designated as EPU are typically early in their characterization process prior to finalizing all electrical and process specifications. Specifications are subject to change without notice. TriQuint Semiconductor Texas : Phone (972)994-8465 Fax (972)994 8504 Web: www.triquint.com Advance Product Information May 16, 2000 TGA1307 TGA1307-EPU - Mechanical Drawing Note: Devices designated as EPU are typically early in their characterization process prior to finalizing all electrical and process specifications. Specifications subject to change without notice TriQuint Semiconductor Texas : Phone (972)994-8465 Fax (972)994 8504 Web: www.triquint.com Advance Product Information May 16, 2000 TGA1307 TGA1307-EPU - Recommended Assembly Drawing Note: Devices designated as EPU are typically early in their characterization process prior to finalizing all electrical and process specifications. Specifications subject to change without notice TriQuint Semiconductor Texas : Phone (972)994-8465 Fax (972)994 8504 Web: www.triquint.com Advance Product Information May 16, 2000 TGA1307 Assembly Process Notes Reflow process assembly notes: *= *= *= *= *= AuSn (80/20) solder with limited exposure to temperatures at or above 300C alloy station or conveyor furnace with reducing atmosphere no fluxes should be utilized coefficient of thermal expansion matching is critical for long-term reliability storage in dry nitrogen atmosphere Component placement and adhesive attachment assembly notes: *= *= *= *= *= *= *= vacuum pencils and/or vacuum collets preferred method of pick up avoidance of air bridges during placement force impact critical during auto placement organic attachment can be used in low-power applications curing should be done in a convection oven; proper exhaust is a safety concern microwave or radiant curing should not be used because of differential heating coefficient of thermal expansion matching is critical Interconnect process assembly notes: *= *= *= *= *= thermosonic ball bonding is the preferred interconnect technique force, time, and ultrasonics are critical parameters aluminum wire should not be used discrete FET devices with small pad sizes should be bonded with 0.0007-inch wire maximum stage temperature: 200C GaAs MMIC devices are susceptible to damage from Electrostatic Discharge. Proper precautions should be observed during handling, assembly and test. Note: Devices designated as EPU are typically early in their characterization process prior to finalizing all electrical and process specifications. Specifications are subject to change without notice. TriQuint Semiconductor Texas : Phone (972)994-8465 Fax (972)994 8504 Web: www.triquint.com |
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